Intel Xeon Gold 6126 12 Core 2.6GHz (3.7GHz Turbo) CD8067303405900 125W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303405900
  • Model: Intel Xeon Gold 6126 Processor
  • Code Name: Skylake
  • Core Count: 12
  • Thread Count: 24
  • Clock Speed: 2.6 GHz
  • Max Turbo Frequency: 3.7 GHz
  • Cache: 19.25 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 125 W
  • Memory Type: DDR4-2666
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel Virtualization Technology for Directed I/O (VT-d)
    • Intel VT-x with Extended Page Tables (EPT)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 2 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 6126T 12 Core 2.6GHz (3.7GHz Turbo) CD8067303593100 125W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5122 4 Core 3.6GHz (3.7GHz Turbo) BX806735122 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: BX806735122
  • Model: Intel Xeon Gold 5122 Processor
  • Core Name: Skylake
  • Core Count: 4
  • Thread Count: 8
  • Clock Speed: 3.6 GHz
  • Max Turbo Frequency: 3.7 GHz
  • Cache: 16.5 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 105 W
  • Memory Type: DDR4-2666
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel Virtualization Technology for Directed I/O (VT-d)
    • Intel VT-x with Extended Page Tables (EPT)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 2 of AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5120T 14 Core 2.2GHz (3.2GHz Turbo) CD8067303535700 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5118 12 Core 2.3GHz (3.2GHz Turbo) CD8067303536100 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303536100
  • Model: Intel Xeon Gold 5118 Processor
  • Core Name: Skylake
  • Core Count: 12
  • Thread Count: 24
  • Clock Speed: 2.3 GHz
  • Max Turbo Frequency: 3.2 GHz
  • Cache: 16.5 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 105 W
  • Memory Type: DDR4-2400
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 1 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5115 10 Core 2.4GHz (3.2GHz Turbo) CD8067303535601 85W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303535601
  • Model: Intel Xeon Gold 5115 Processor
  • Core Name: Skylake
  • Core Count: 10
  • Thread Count: 20
  • Clock Speed: 2.4 GHz
  • Max Turbo Frequency: 3.2 GHz
  • Cache: 13.75 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 85 W
  • Memory Type: DDR4-2400
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 1 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Supermicro CSE-116TQ-R700CB 1U Rackmount 10x 2.5″ Hot-swap SAS/SATA HDD 700W/750W Hosting Storage Server Chassis

  • Mfr Part Number: CSE-116TQ-R700CB
  • Case Type: 1U Rackmount
  • Color: Black
  • M/B Type: EATX (12.0 x 13.0 inch)
  • Processor Support: Dual, Single Intel / AMD Processor
  • Drive Bays: 10x 2.5″ Hot-swap SAS/SATA HDD Trays
  • Expansion Slots: 1x Full-height and Full-length PCI Expansion Slot
  • Backplane: 1x 1U SAS/SATA backplane w/ SES2
  • Cooling System: 4x (40x56mm) Counter-rotating PWM Fans
  • Front Panel:
    • Buttons: Power On/Off, UID
    • LEDs: Power Status, HDD Activity, 2x Network Activity, Universal Information (UID)
    • Ports: 2x USB Ports
  • Power Supply: 700W/750W 80 PLUS Gold Certified Redundant AC-DC High-efficiency Power Supply w/ PMBus & I2C
  • Dimensions (WxDxH): 17.2 x 23.5 x 1.7 inch / 437.0 x 597.0 x 43.0 mm
  • Weight: 40.0 lbs / 18.2 kg

Supermicro AS-2113S-WTRT AMD EPYC 1S 16 SATA3 or 10 SATA 3 + 6 U.2 NVMe 2TB ECC M.2 2x10GbE 2U Virtualization Cloud Hosting Flexible Storage Server

AS-2113S-WTRT

AS-2113S-WTRT Key Features

  • Single AMD EPYC™ 7000-Series Processor
  • Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Expansion slots: 1 PCI-E 3.0 x16 (FH/HL) slot, 2 PCI-E 3.0 x8 (FH/HL) slots, 2 PCI-E 3.0 x8 (LP) slots2 Interface: PCI-E 3.0 x4 (NVMe based), M.2 Form Factor: 2280, 22110,  M.2 Key: Onboard M-key, Number of M.2: Dual
  • Integrated IPMI 2.0 + KVM with dedicated LAN
  • 2x 10GBase-T LAN ports via Broadcom BCM57416
  • 16 hot-swap 2.5″ SATA3 drive bays, or 10 hot-swap 2.5″ SATA3 drive bays + optional 6 U.2 NVMe drive support with additional cables
  • 1200W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration
    and application load)
  • Product Type : Server Barebone (chassis, motherboard power supply); sold only as complete system
  • Manufacturer Part Number: AS-2113S-WTRT

Featuring New AMD EPYC™ 7000 Series Processors

Supermicro’s new AMD servers are engineered to unleash the full performance and rich feature sets on the new AMD EPYC™ 7000 Series processor family with more cores, more memory, more I/O, and more security. AMD EPYC powers your application with 32 cores, 64 threads, 8 memory channels with up to 2 TB of memory per socket, and 128 PCIe-3 lanes coupled with the industry’s first hardware-embedded x86 server security solution. With servers built on EPYC technology, cloud environments can drive greater scale and performance, virtualized datacenters can further increase consolidation ratios while delivering better performing virtual machines and Big Data, and analytics environments can collect and analyze larger data sets much faster. High performance applications in research labs can solve complex problem sets in a significantly accelerated manner. EPYC, with all the critical compute, memory, I/O, and security resources brought together in the SoC with the right ratios, delivers industry-leading performance and enables lower TCO. With the flexibility to choose from 8 to 32 cores, EPYC enables you to deploy the right hardware platforms to meet your workload needs from virtualized infrastructure to large-scale big-data and analytics platforms and legacy line-of-business applications. For exact sever specifications, please see highlights below and also refer to detailed technical specifications.

Server Systems Management

Supermicro Server Manager (SSM) provides capabilities to monitor the health of server components including memory, hard drives and RAID controllers. It enables the datacenter administrator to monitor and manage power usage across all Supermicro servers allowing users to maximize their CPU payload while mitigating the risk of tripped circuit. Firmware upgrades on Supermicro servers became easier now with a couple of clicks. Administrators can now mount an ISO image on multiple servers and reboot the servers with those images. The tool also provides pre-defined reports and many more features that will make managing Supermicro servers simpler. Download the SSM_brochure for more info or download Supermicro SuperDoctor® device monitoring and management software.

Technical Specifications

Product SKUs
AS-2113S-WTRT
  • A+ Server 2113S-WTRT
Motherboard
H11SSW-NT
Processor/Chipset
CPU
  • Single AMD EPYC™ 7000-series Processor
  • Socket SP3
Cores
  • Up to 32 Cores
Chipset
  • System on Chip (SoC)
System Memory
Memory Capacity
  • 16 DIMM slots
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
  • 8-channel memory bus
Memory Type
  • DDR4 2666 MHz Registered ECC, 240-pin gold-plated DIMMs
DIMM Sizes
  • 4GB, 8GB, 16GB, 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Broadcom BCM57416 Controller
VGA
  • ASPEED AST2500 BMC
Expansion Slots
PCI Express
  • 1 PCI-E 3.0 x16 (FH/HL) slot
  • 2 PCI-E 3.0 x8 (FH/HL) slots
  • 2 PCI-E 3.0 x8 (LP) slots
M.2
  • Interface: PCI-E 3.0 x4 (NVMe based)
  • Form Factor: 2280, 22110
  • Key: Onboard M-key
  • Number of M.2: Dual
Input / Output
NVMe
  • Up to 6 U.2 NVMe support via additional cables
SATA
  • 16 SATA3 (6 Gbps) ports
LAN
  • 2x 10GbBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 5 USB 3.0 ports (4 rear + 1 Type A)
  • 2 USB 2.0 ports (front) via optional tray
VGA
  • 1 VGA port
Others
  • 1 COM port
  • 2 SATA DOM power connectors
  • TPM 1.2 header
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Chassis
Form Factor
  • 2U
Model
  • CSE-213AC8-R1K23WB
Dimensions
Height
  • 3.5″ (89mm)
Width
  • 17.2″ (437mm)
Depth
  • 24.8″ (630mm)
Weight
  • Net Weight: 34 lbs (15.42 kg)
  • Gross Weight: 59 lbs (26.76 kg)
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • Power LED
  • Hard drive activity LED
  • 2x Network activity LEDs
  • System Overheat LED / Fan fail LED /
    UID LED
Drive Bays
Hot-swap
  • 16 hot-swap 2.5″ SATA3 drive bays
  • Optional 6 U.2 NVMe drive support with additional cables
Peripheral Drives
Optional
  • Optional slim DVD-ROM drive
  • 2 USB 2.0 ports
  • 1 COM port tray
Backplane
Hybrid Backplane
  • Supports up to 8x 2.5″ SAS3/SATA3 HDD/SSD and 6x SAS3/SATA3/NVMe Storage Devices
System Cooling
Fans
  • 3 heavy-duty PWM fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply (76mm Width)
1200W Redundant Power Supplies with PMBus
Total Output Power
  • 1000W/1200W
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
Input
  • 100-127Vac / 15-12A / 50-60Hz
  • 200-240Vac / 8.5-7A / 50-60Hz
  • 200-240Vdc / 8.5-7A (for CCC only)
+12V
  • Max: 83A / Min: 0A (100-127Vac)
  • Max: 100A / Min: 0A (200-240Vac)
  • Max: 100A / Min: 0A (200-240Vdc)
+5Vsb
  • Max: 4A / Min: 0A
Output Type
  • 19 Pairs Gold Finger Connector
Certification Platinum Level Certified95%+
UL/cUL/CB/BSMI/CE/CCC
Titanium Level
Test Report ]
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, 3.3V standby, VBAT
  • CPU switching voltage regulator
FAN
  • Up to 6-fan status tachometer monitoring
  • Up to six 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 6x Fan connectors
  • I²C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
Operating Environment / Compliance
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)

Supermicro AS-2113S-WN24RT AMD EPYC 1S 24 NVMe U.2 2TB ECC M.2 2x10GbE R750W 2U Virtualization Cloud Hosting All Flash Storage Server

AS-2113S-WN24RT

AS-2113S-WN24RT Key Features

  • Single AMD EPYC™ 7000-Series Processor
  • Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Expansion slots: 1 PCI-E 3.0 x16 (FH/HL) slot, M.2 Interface: PCI-E 3.0 x4 (NVMe based), M.2 Form Factor: 2280, 22110, M.2 Key: Onboard M-key, Number of M.2: Dual
  • Integrated IPMI 2.0 + KVM with dedicated LAN
  • 2x 10GBase-T LAN ports via Broadcom BCM57416
  • 24 hot-swap 2.5″ U.2 NVMe drive bays
  • 750W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration
    and application load)
  • Product Type : Server Barebone (chassis, motherboard power supply); sold only as complete system
  • Manufacturer Part Number: AS-2113S-WN24RT

Featuring New AMD EPYC™ 7000 Series Processors

Supermicro’s new AMD servers are engineered to unleash the full performance and rich feature sets on the new AMD EPYC™ 7000 Series processor family with more cores, more memory, more I/O, and more security. AMD EPYC powers your application with 32 cores, 64 threads, 8 memory channels with up to 2 TB of memory per socket, and 128 PCIe-3 lanes coupled with the industry’s first hardware-embedded x86 server security solution. With servers built on EPYC technology, cloud environments can drive greater scale and performance, virtualized datacenters can further increase consolidation ratios while delivering better performing virtual machines and Big Data, and analytics environments can collect and analyze larger data sets much faster. High performance applications in research labs can solve complex problem sets in a significantly accelerated manner. EPYC, with all the critical compute, memory, I/O, and security resources brought together in the SoC with the right ratios, delivers industry-leading performance and enables lower TCO. With the flexibility to choose from 8 to 32 cores, EPYC enables you to deploy the right hardware platforms to meet your workload needs from virtualized infrastructure to large-scale big-data and analytics platforms and legacy line-of-business applications. For exact sever specifications, please see highlights below and also refer to detailed technical specifications.

Server Systems Management

Supermicro Server Manager (SSM) provides capabilities to monitor the health of server components including memory, hard drives and RAID controllers. It enables the datacenter administrator to monitor and manage power usage across all Supermicro servers allowing users to maximize their CPU payload while mitigating the risk of tripped circuit. Firmware upgrades on Supermicro servers became easier now with a couple of clicks. Administrators can now mount an ISO image on multiple servers and reboot the servers with those images. The tool also provides pre-defined reports and many more features that will make managing Supermicro servers simpler. Download the SSM_brochure for more info or download Supermicro SuperDoctor® device monitoring and management software.

Technical Specifications

Product SKUs
AS -2113S-WN24RT
  • A+ Server 2113S-WN24RT
Motherboard
H11SSW-NT
Processor/Chipset
CPU
  • Single AMD EPYC™ 7000-series Processor
  • Socket SP3
Cores
  • Up to 32 Cores
Chipset
  • System on Chip (SoC)
System Memory
Memory Capacity
  • 16 DIMM slots
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
  • 8-channel memory bus
Memory Type
  • DDR4 2666 MHz Registered ECC, 240-pin gold-plated DIMMs
DIMM Sizes
  • 4GB, 8GB, 16GB, 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Broadcom BCM57416 Controller
VGA
  • ASPEED AST2500 BMC
Expansion Slots
PCI Express
  • 1 PCI-E 3.0 x16 (FH/HL) slot
M.2
  • Interface: PCI-E 3.0 x4 (NVMe based)
  • Form Factor: 2280, 22110
  • Key: Onboard M-key
  • Number of M.2: Dual
Input / Output
NVMe
  • Up to 24 U.2 NVMe support
LAN
  • 2x 10GbBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 5 USB 3.0 ports (4 rear + 1 Type A)
VGA
  • 1 VGA port
Others
  • 1 COM port
  • 2 SATA DOM power connectors
  • TPM 1.2 header
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Chassis
Form Factor
  • 2U
Model
  • CSE-216BTS-R1K23WBP
Dimensions
Height
  • 3.5″ (89mm)
Width
  • 17.2″ (437mm)
Depth
  • 24.8″ (630mm)
Weight
  • Net Weight: 34 lbs (15.42 kg)
  • Gross Weight: 59 lbs (26.76 kg)
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • Power LED
  • Hard drive activity LED
  • 2x Network activity LEDs
  • System Overheat LED / Fan fail LED /
    UID LED
Drive Bays
Hot-swap
  • 24 hot-swap 2.5″ U.2 NVMe drive bays
System Cooling
Fans
  • 3 heavy-duty PWM fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
Power Supply (76mm Width)
1200W Redundant Power Supplies with PMBus
Total Output Power
  • 1000W/1200W
Dimension
(W x H x L)
  • 76 x 40 x 336 mm
Input
  • 100-127Vac / 15-12A / 50-60Hz
  • 200-240Vac / 8.5-7A / 50-60Hz
  • 200-240Vdc / 8.5-7A (for CCC only)
+12V
  • Max: 83A / Min: 0A (100-127Vac)
  • Max: 100A / Min: 0A (200-240Vac)
  • Max: 100A / Min: 0A (200-240Vdc)
+5Vsb
  • Max: 4A / Min: 0A
Output Type
  • 19 Pairs Gold Finger Connector
Certification Platinum Level Certified95%+
UL/cUL/CB/BSMI/CE/CCC
Titanium Level
Test Report ]
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, 3.3V standby, VBAT
  • CPU switching voltage regulator
FAN
  • Up to 6-fan status tachometer monitoring
  • Up to six 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 6x Fan connectors
  • I²C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
Operating Environment / Compliance
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)

Supermicro AS-1113S-WN10RT AMD EPYC 1S 10 NVMe U.2 2TB ECC M.2 2x10GbE R750W 1U Virtualization Cloud Hosting All Flash Storage Server

AS-1113S-WN10RT

AS-1113S-WN10RT Key Features

  • Single AMD EPYC™ 7000-Series Processor
  • Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Expansion slots: 2 PCI-E 3.0 x16 (FH/HL) slots, 1 PCI-E 3.0 x16 (LP) slot, M.2 Interface: PCI-E 3.0 x4 (NVMe based), M.2 Form Factor: 2280, 22110, M.2 Key: Onboard M-key, Number of M.2: Dual
  • Integrated IPMI 2.0 + KVM with dedicated LAN
  • 2x 10GBase-T LAN ports via Broadcom BCM57416
  • 10 hot-swap 2.5″ U.2 NVMe drive bays, optional 4 SATA3 drive support with additional cables
  • 750W Redundant Power Supplies Platinum Level (94%) (Full redundancy based on configuration
    and application load)
  • Product Type : Server Barebone (chassis, motherboard power supply); sold only as complete system
  • Manufacturer Part Number: AS-1113S-WN10RT

Featuring New AMD EPYC™ 7000 Series Processors

Supermicro’s new AMD servers are engineered to unleash the full performance and rich feature sets on the new AMD EPYC™ 7000 Series processor family with more cores, more memory, more I/O, and more security. AMD EPYC powers your application with 32 cores, 64 threads, 8 memory channels with up to 2 TB of memory per socket, and 128 PCIe-3 lanes coupled with the industry’s first hardware-embedded x86 server security solution. With servers built on EPYC technology, cloud environments can drive greater scale and performance, virtualized datacenters can further increase consolidation ratios while delivering better performing virtual machines and Big Data, and analytics environments can collect and analyze larger data sets much faster. High performance applications in research labs can solve complex problem sets in a significantly accelerated manner. EPYC, with all the critical compute, memory, I/O, and security resources brought together in the SoC with the right ratios, delivers industry-leading performance and enables lower TCO. With the flexibility to choose from 8 to 32 cores, EPYC enables you to deploy the right hardware platforms to meet your workload needs from virtualized infrastructure to large-scale big-data and analytics platforms and legacy line-of-business applications. For exact sever specifications, please see highlights below and also refer to detailed technical specifications.

Server Systems Management

Supermicro Server Manager (SSM) provides capabilities to monitor the health of server components including memory, hard drives and RAID controllers. It enables the datacenter administrator to monitor and manage power usage across all Supermicro servers allowing users to maximize their CPU payload while mitigating the risk of tripped circuit. Firmware upgrades on Supermicro servers became easier now with a couple of clicks. Administrators can now mount an ISO image on multiple servers and reboot the servers with those images. The tool also provides pre-defined reports and many more features that will make managing Supermicro servers simpler. Download the SSM_brochure for more info or download Supermicro SuperDoctor® device monitoring and management software.

Technical Specifications

Product SKUs
AS -1113S-WN10RT
  • A+ Server 1113S-WN10RT
Motherboard
H11SSW-NT
Processor/Chipset
CPU
  • Single AMD EPYC™ 7000-series Processor
  • Socket SP3
Cores
  • Up to 32 Cores
Chipset
  • System on Chip (SoC)
System Memory
Memory Capacity
  • 16 DIMM slots
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM
  • 8-channel memory bus
Memory Type
  • DDR4 2666 MHz Registered ECC, 240-pin gold-plated DIMMs
DIMM Sizes
  • 4GB, 8GB, 16GB, 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Broadcom BCM57416 Controller
VGA
  • ASPEED AST2500 BMC
Expansion Slots
PCI Express
  • 2 PCI-E 3.0 x16 (FH/HL) slots
  • 1 PCI-E 3.0 x16 (LP) slot
M.2
  • Interface: PCI-E 3.0 x4 (NVMe based)
  • Form Factor: 2280, 22110
  • Key: Onboard M-key
  • Number of M.2: Dual
Input / Output
NVMe
  • Up to 10 U.2 NVMe support
SATA
  • Optional 4 SATA3 (6 Gbps) support via additional cables
LAN
  • 2x 10GbBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 7 USB 3.0 ports (4 rear + 2 front + 1 Type A)
VGA
  • 1 VGA port
Others
  • 1 COM port
  • 2 SATA DOM power connectors
  • TPM 1.2 header
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Chassis
Form Factor
  • 1U
Model
  • CSE-116TS-R706WBP3
Dimensions
Height
  • 1.7″ (43mm)
Width
  • 17.2″ (437mm)
Depth
  • 23.5″ (597mm)
Weight
  • Net Weight: 20 lbs (9.1 kg)
  • Gross Weight: 33 lbs (15.0 kg)
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • Power LED
  • Hard drive activity LED
  • 2x Network activity LEDs
  • System Overheat LED / Fan fail LED /
    UID LED
Drive Bays
Hot-swap
  • 10 hot-swap 2.5″ U.2 NVMe drive bays
Backplane
Hybrid Backplane
  • Supports up to 10x 2.5″ NVMe storage devices, 4 of them SAS3/SATA3 compatible
System Cooling
Fans
  • 6 heavy-duty PWM fans with optimal fan speed control
Air Shroud
  • 1 Air Shroud
AC/DC240V Input Redundant Power Supply
700W/750W Redundant Power Supplies with PMBus
Total Output Power
  • 700W/750W
Dimension
(W x H x L)
  • 54.5 x 40.25 x 320 mm
Input
  • 100 – 140Vac / 8 – 6A / 50-60Hz
  • 200 – 240Vac / 4.5 – 3.8A / 50-60Hz
  • 200 – 240Vdc / 4.5 – 3.8A (CCC Only)
+12V
  • Max: 58A / Min: 0.5A (100 – 140Vac)
  • Max: 62A / Min: 0.5A (200 – 240Vac)
  • Max: 62A / Min: 0.5A (200 – 240Vdc)
    (CB/CCC Only)
+5V sb
  • Max: 3A / Min: 0A
Output Type
  • Gold Finger Connector Mating with Molex 45984-4343
Certification Platinum Level Certified
UL/cUL/CB/BSMI/CE/CCC
Platinum Certified
Test Report ]
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +12V, +3.3V, +5V, +5V standby, 3.3V standby, VBAT
  • CPU switching voltage regulator
FAN
  • Up to 6-fan status tachometer monitoring
  • Up to six 4-pin fan headers
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 6x Fan connectors
  • I²C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
Operating Environment / Compliance
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C to 30°C (50°F to 86°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)