Supermicro MBD-H11DSi-NT-B AMD EPYC 2S 2TB ECC 2xNVMe 2x10GbE Datacenter Virtualization Cloud High Performance Database Storage Server Board

Supermicro MBD-H11DSi-NT-B

Key Features

  • Dual AMD EPYC™ 7000-Series Processors
  • 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Expansion slots: 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, M.2 Interface: 1 SATA/PCI-E 3.0 x2, M.2 Form Factor: 2280, 22110, M.2 Key: M-key
  • 2 Internal NVMe Ports (PCI-E 3.0 x4)
  • 10 SATA3, 1 M.2, 2 SATA DOM
  • Dual 10GBase-T LAN Ports
  • ASPEED AST2500 BMC graphics
  • Up to 2 USB 3.0 ports, Up to 4 USB 2.0 ports
  • 8 4-pin PWM Fan & Speed control
  • Product Type: Motherboard
  • Manufacturer Part Number: MBD-H11DSi-NT-B (Bulk Pack/Not Retail)

Featuring New AMD EPYC™ 7000 Series Processors

Tyan’s new AMD servers are engineered to unleash the full performance and rich feature sets on the new AMD EPYC™ 7000 Series processor family with more cores, more memory, more I/O, and more security. AMD EPYC processors are based on the 14nm “Zen” x86 core architecture with 32 cores and 64 threads, featuring 8 memory channels and up to16 DIMMs per socket. The new powerful processor allows Tyan to offer the optimal balance of computing, memory and I/O for the customers. By adopting the latest AMD EPYC processor technology, Tyan brings high memory channel bandwidth and PCI Express high speed I/O connectivity features to enterprises and data centers. With servers built on EPYC technology, cloud environments can drive greater scale and performance, virtualized data centers can further increase consolidation ratios while delivering better performing virtual machines and Big Data, and analytics environments can collect and analyze larger data sets much faster. High performance applications in research labs can solve complex problem sets in a significantly accelerated manner. EPYC, with all the critical compute, memory, I/O, and security resources brought together in the SoC with the right ratios, delivers industry-leading performance and enables lower TCO. With the flexibility to choose from 8 to 32 cores, EPYC enables you to deploy the right hardware platforms to meet your workload needs from virtualized infrastructure to large-scale big-data and analytics platforms and legacy line-of-business applications. For exact sever specifications, please see highlights below and also refer to detailed technical specifications.Technical Specifications

Technical Specifications

Product SKUs
MBD-H11DSi-NT
  • H11DSi-NT
MBD-H11DSi-NT-B
  • H11DSi-NT (Bulk Pack)
Physical Stats
Form Factor
  • E-ATX
Dimensions
  • 12″ x 13.05″ (30.5cm x 33.1cm)
Processor/Chipset
CPU
  • Dual AMD EPYC™ 7000-series Processors
  • Socket SP3
Cores
  • Up to 32 Cores
Chipset
  • System on Chip
System Memory
Memory Capacity
  • 16 DIMM sockets
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • 8-channel memory bus
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
  • See Detailed Memory Support Matrix
Memory Type
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA3 (6 Gbps)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • Intel® X550 10G Base-T Ethernet Controller
  • 1 Realtek RTL8211E PHY (dedicated IPMI)
VGA
  • ASPEED AST2500 BMC
Input / Output
SATA
  • 10 SATA3 (6 Gbps) ports
NVMe
  • 2 Internal NVMe Ports (PCI-E 3.0 x4)
LAN
  • 2 RJ45 10GBase-T ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
  • 4 USB 2.0 ports (2 rear + 2 via header)
VGA
  • 1 VGA port
Others
  • 1 COM port (rear)
  • 2 SATA DOM power connectors
  • 1 TPM 2.0 header
Expansion Slots
PCI-Express
  • 3 PCI-E 3.0 x8
  • 2 PCI-E 3.0 x16
M.2
  • Interface: 1 SATA/PCI-E 3.0 x2
  • Form factor: 2280, 22110
  • Key: M-key
Chassis ( Optimized for H11DSI-NT )
2U
3U
4U
Server(s) ( with H11DSI-NT )
Model(s)
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.1V, +1.5V, +1.8V, +12V, +5V, +5V standby
  • CPU switching voltage regulator
FAN
  • Up to 8-fan status tachometer monitoring
  • Up to eight 4-pin fan headers
  • Dual Cooling Zone
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 8x Fan connectors
  • I2C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
  • UID
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)

Supermicro MBD-H11DSi-B AMD EPYC 2S 2TB 2GbE Datacenter Virtualization Cloud High Performance Database Storage Server Board

Supermicro MBD-H11DSi-B

Key Features

  • Dual AMD EPYC™ 7000-Series Processors
  • 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • Expansion slots: 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 M.2 Interface: 1 SATA/PCI-E 3.0 x2 M.2 Form Factor: 2280, 22110
  • M.2 Key: M-key
  • 10 SATA3, 1 M.2, 2 SATA DOM
  • Dual Gigabit Ethernet LAN Ports
  • ASPEED AST2500 BMC graphics
  • Up to 2 USB 3.0 ports
  • Up to 4 USB 2.0 ports
  • 8 4-pin PWM Fan & Speed control
  • Product Type: Motherboard
  • Manufacturer Part Number: MBD-H11DSi-B (Bulk Pack/Not Retail)

Featuring New AMD EPYC™ 7000 Series Processors

Tyan’s new AMD servers are engineered to unleash the full performance and rich feature sets on the new AMD EPYC™ 7000 Series processor family with more cores, more memory, more I/O, and more security. AMD EPYC processors are based on the 14nm “Zen” x86 core architecture with 32 cores and 64 threads, featuring 8 memory channels and up to16 DIMMs per socket. The new powerful processor allows Tyan to offer the optimal balance of computing, memory and I/O for the customers. By adopting the latest AMD EPYC processor technology, Tyan brings high memory channel bandwidth and PCI Express high speed I/O connectivity features to enterprises and data centers. With servers built on EPYC technology, cloud environments can drive greater scale and performance, virtualized data centers can further increase consolidation ratios while delivering better performing virtual machines and Big Data, and analytics environments can collect and analyze larger data sets much faster. High performance applications in research labs can solve complex problem sets in a significantly accelerated manner. EPYC, with all the critical compute, memory, I/O, and security resources brought together in the SoC with the right ratios, delivers industry-leading performance and enables lower TCO. With the flexibility to choose from 8 to 32 cores, EPYC enables you to deploy the right hardware platforms to meet your workload needs from virtualized infrastructure to large-scale big-data and analytics platforms and legacy line-of-business applications. For exact sever specifications, please see highlights below and also refer to detailed technical specifications.Technical Specifications

Technical Specifications

Product SKUs
MBD-H11DSi
  • H11DSi
MBD-H11DSi-B
  • H11DSi (Bulk Pack)
Physical Stats
Form Factor
  • E-ATX
Dimensions
  • 12″ x 13.05″ (30.5cm x 33.1cm)
Processor/Chipset
CPU
  • Dual AMD EPYC™ 7000-series Processors
  • Socket SP3
Cores
  • Up to 32 Cores
Chipset
  • System on Chip
System Memory
Memory Capacity
  • 16 DIMM sockets
  • Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
  • 8-channel memory bus
  • For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks
  • See Detailed Memory Support Matrix
Memory Type
  • DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs
DIMM Sizes
  • 8GB, 16GB, 32GB, 64GB, 128GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
SATA
  • SATA3 (6 Gbps)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Network Controllers
  • 2 1GbE LAN via Intel® i350-AM21
  • 1 Realtek RTL8211E PHY (dedicated IPMI)
VGA
  • ASPEED AST2500 BMC
Input / Output
SATA
  • 10 SATA3 (6 Gbps) ports
LAN
  • 2 RJ45 Gigabit Ethernet LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 3.0 ports (rear)
  • 4 USB 2.0 ports (2 rear + 2 via header)
VGA
  • 1 VGA port
Others
  • 1 COM port (rear)
  • 2 SATA DOM power connector
  • 1 TPM 2.0 header
Expansion Slots
PCI-Express
  • 3 PCI-E 3.0 x8
  • 2 PCI-E 3.0 x16
M.2
  • Interface: 1 SATA/PCI-E 3.0 x2
  • Form factor: 2280, 22110
  • Key: M-key
Chassis ( Optimized for H11DSi )
2U
3U
4U
System BIOS
BIOS Type
  • AMI 128Mb SPI Flash EEPROM
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 5.1
  • USB Keyboard Support
  • SMBIOS 3.1.1
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode control for AC power loss recovery
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.5V, +1.8V, +12V +5V, +5V standby
  • CPU switching voltage regulator
  • Supports system management utility
  • VBAT
FAN
  • Up to 8-fan status tachometer monitoring
  • Up to eight 4-pin fan headers
  • Dual Cooling Zone
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 8x Fan connectors
  • I2C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
Other Features
  • Chassis Intrusion Detection
  • Chassis Intrusion Header
  • UID
Operating Environment / Compliance
Environmental Specifications
  • Operating Temperature:
    10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
    -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)

Supermicro CSE-847BE2C-R1K28LPB 4U Rackmount 36×3.5” HS SAS/SATA 7LP PCIe Slot 1280W DataCenter Network Security Storage Server Chassis

  • Mfr Part Number: CSE-847BE2C-R1K28LPB
  • Case Type: 4U Rackmount
  • Color: Black
  • M/B Type: Motherboard Support Size of 13.68″ x 13″, 9.6″ x 9.6″
  • Processor Support: Single and Dual Intel and AMD processors
  • Drive Bays: 36x 3.5″ Hot-swap SAS/SATA/ HDD Drive Bays
  • Expansion Slots: 7x Low-profile Expansion Slots
  • Backplane: HDD Backplane supports 36 SAS hard drives
  • Cooling System: 7x 8cm hot-swap PWM cooling fans (7000 RPM)
  • Front I/O Panel:
    • Buttons: Power On/Off, System Reset
    • LEDs: 2x Network Activity, Fan Fail/System Over Heat, Hard Drive Activity, Power Status, Unit Identification (UID)
  • Power Supply: 1280W 80 PLUS Platinum Certified High-Efficiency (95%+) power supply
  • Dimensions (WxDxH): 17.2 x 27.5 x 7.0 inch / 437.0 x 699.0 x 178.0 mm
  • Gross Weight: 75.0 lbs / 34.02 kg

Supermicro CSE-847BE1C-R1K28LPB 4U Rackmount 36×3.5” HS SAS/SATA 7LP PCIe Slot 1280W DataCenter Network Security Storage Server Chassis

  • Mfr Part Number: CSE-847BE1C-R1K28LPB
  • Case Type: 4U Rackmount
  • Color: Black
  • M/B Type: Motherboard Support Size of 13.68″ x 13.00″, 9.6″ x 9.6″
  • Processor Support: Single and Dual Intel and AMD processors
  • Drive Bays: 36x 3.5″ Hot-swap SAS/SATA Drive Bays
  • Expansion Slots: Up to Without Universal I/O (UIO) Card – 7x low-profile expansion slots
  • Backplane: HDD Backplane supports 36 SAS hard drives
  • Cooling System: 7x 8cm (7000 RPM) Hot-swap PWM Cooling Fan
  • Front I/O Panel:
    • Buttons: Power On/Off, System Reset
    • LEDs: 2x Network Activity, Fan Fail/System Over Heat, Hard Drive Activity, Power Status, Unit Identification (UID)
  • Power Supply: 1280W 80 PLUS Platinum Certified High-Efficiency (95%+) power supply
  • Dimensions (WxDxH): 17.2 x 27.5 x 7.0 inch / 437.0 x 699.0 x 178.0 mm
  • Gross Weight: 75.0 lbs / 34.02 kg

Intel Xeon Gold 6126 12 Core 2.6GHz (3.7GHz Turbo) CD8067303405900 125W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303405900
  • Model: Intel Xeon Gold 6126 Processor
  • Code Name: Skylake
  • Core Count: 12
  • Thread Count: 24
  • Clock Speed: 2.6 GHz
  • Max Turbo Frequency: 3.7 GHz
  • Cache: 19.25 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 125 W
  • Memory Type: DDR4-2666
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel Virtualization Technology for Directed I/O (VT-d)
    • Intel VT-x with Extended Page Tables (EPT)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 2 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 6126T 12 Core 2.6GHz (3.7GHz Turbo) CD8067303593100 125W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5122 4 Core 3.6GHz (3.7GHz Turbo) BX806735122 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: BX806735122
  • Model: Intel Xeon Gold 5122 Processor
  • Core Name: Skylake
  • Core Count: 4
  • Thread Count: 8
  • Clock Speed: 3.6 GHz
  • Max Turbo Frequency: 3.7 GHz
  • Cache: 16.5 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 105 W
  • Memory Type: DDR4-2666
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel Virtualization Technology for Directed I/O (VT-d)
    • Intel VT-x with Extended Page Tables (EPT)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 2 of AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5120T 14 Core 2.2GHz (3.2GHz Turbo) CD8067303535700 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5118 12 Core 2.3GHz (3.2GHz Turbo) CD8067303536100 105W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303536100
  • Model: Intel Xeon Gold 5118 Processor
  • Core Name: Skylake
  • Core Count: 12
  • Thread Count: 24
  • Clock Speed: 2.3 GHz
  • Max Turbo Frequency: 3.2 GHz
  • Cache: 16.5 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 105 W
  • Memory Type: DDR4-2400
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 1 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.

Intel Xeon Gold 5115 10 Core 2.4GHz (3.2GHz Turbo) CD8067303535601 85W Server Processor Deep Learning Big Data Analytics Virtualization VDI Storage

Technical Specifications

  • Mfr Part Number: CD8067303535601
  • Model: Intel Xeon Gold 5115 Processor
  • Core Name: Skylake
  • Core Count: 10
  • Thread Count: 20
  • Clock Speed: 2.4 GHz
  • Max Turbo Frequency: 3.2 GHz
  • Cache: 13.75 MB L3
  • Lithography: 14 nm
  • Socket: LGA 3647
  • Thermal Design Power: 85 W
  • Memory Type: DDR4-2400
  • Advanced Technologies:
    • Intel Speed Shift Technology
    • Intel Turbo Boost 2.0 Technology
    • Intel vPro Technology
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel TSX-NI
    • Intel 64
    • Instruction Set Extensions – Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
    • 1 AVX-512 FMA Units
    • Enhanced Intel SpeedStep Technology
    • Intel Volume Management Device (VMD)
    • Intel AES New Instructions
    • Intel Trusted Execution Technology
    • Execute Disable Bit
    • Intel Run Sure Technology
    • Mode-based Execute Control (MBE)

New Intel Skylake Scalable Xeon® Processors

The Intel® Xeon® Scalable platform provides the foundation for a powerful data center platform that creates an evolutionary leap in agility and scalability. Disruptive by design, this innovative processor sets a new level of platform convergence and capabilities across compute, storage, memory, network, and security. Enterprises and cloud and communications service providers can now drive forward their most ambitious digital initiatives with a feature-rich, highly versatile platform. 

Enhancements over Previous Generation Xeon

  • Higher per-core performance: Up to 28 cores, delivering high performance and scalability for compute-intensive workloads across compute, storage, and network usages.
  • Greater memory bandwidth/capacity: 50 percent increased memory bandwidth and capacity. Six memory channels versus four memory channels of previous generation for memory-intensive workloads.
  • Expanded I/O: 48 lanes of PCIe* 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
  • Intel® Ultra Path Interconnect (Intel® UPI): Up to three Intel® UPI channels increase scalability of the platform to as many as eight sockets, as well as improves inter-CPU bandwidth for I/O-intensive workloads versus previous generation13 (with Intel® QuickPath Interconnect (Intel® QPI)). Intel UPI offers the perfect balance between improved throughput and energy efficiency.
  • Intel® Advanced Vector Extensions 512 (Intel® AVX-512): With double the flops per clock cycle compared to previous generation Intel® Advanced Vector Extensions 2 (Intel® AVX2)14, Intel® AVX-512 boosts performance, and throughput for the most demanding computational tasks in applications, such as modeling and simulation, data analytics and machine learning, data compression, visualization, and digital content creation.
  • Security without compromise: Near-zero encryption overhead15 enables higher performance on all secure data transactions.