- Manufacturer Part Number: RS720Q-E10-WOCPU005Z
- Number of Nodes: 4
- Number of Processors Supported: 2
- Processor Socket: Socket LGA-4189
- Processor Supported:
- Xeon Platinum
- Xeon Gold
- Xeon Silver
- Xeon Bronze
- Processor Manufacturer: Intel
- Processor Generation: 3rd Gen
- 64-bit Processing: Yes
- Chipset Manufacturer: Intel
- Chipset Model: C621A
- Maximum Memory Supported: 6 TB
- Memory Technology: DDR4 SDRAM
- Memory Standard: DDR4-3200/PC4-25600
- Number of Total Memory Slots: 16
- Intel Optane Memory Ready: Yes
- Controller Type:
- Serial ATA
- Serial Attached SCSI (SAS)
- RAID Supported: Yes
- Graphics Controller Manufacturer: ASPEED
- Graphics Controller Model: AST2600
- Graphics Memory Capacity: 64 MB
- Ethernet Technology: Gigabit Ethernet
- Number of Total Expansion Bays: 8
- Number of Internal 2.5″ Bays: 8
- Number of Total Expansion Slots: 2
- Number of PCI Express x16 Slots: 2
- Total Number of USB Ports: 2
- Number of USB 3.0 Ports: 2
- Number of VGA Ports: 1
- Input Voltage: 230 V AC
- Number of Power Supplies Installed: 2
- Maximum Power Supply Wattage: 3000 W
- Form Factor: Rack-mountable
- Rack Height: 2U
- Height: 3.5″
- Width: 17.5″
- Depth: 31.5″
- Weight (Approximate): 78.26 lb
- Environmentally Friendly: Yes
- Environmental Certification: RoHS
Overview
Great Scalability and High Performance Computing (HPC) with 4 nodes in a 2U Rack Sever
ASUS RS720Q-E10-RS8U is the ideal multi-node server powered by 3rd Gen Intel® Xeon Scalable processors, with each node supporting up to 16 DIMM, one PCIe® 4.0 slot, one OCP 3.0 and two M.2, and a total of eight NVMe/SAS/SATA drives.
3rd Gen Intel Xeon Scalable processors
The RS720Q-E9-RS8-S is built with the latest Intel® Xeon® Processor Scalable Family with 16 DDR4 Memory up to 3200MHz, and designed for the demand of high scalability, high density computing, and wide range of existing and emerging workloads.
PCIe 4.0 Ready
PCI Express® (PCIe®) 4.0 delivers 16 GT/s bandwidth, which is double the speed of PCIe 3.0, offering lower power consumption, better lane scalability and backwards compatibility.
Cooling Solutions
Air or liquid-cooled solutions. Asetek’s Direct-to-Chip (D2C) liquid-cooling technology achieving lower power-usage effectiveness (PUE) and optimized TCO for data centers.
Enhanced Security
PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.
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