Supermicro SSG-1129P-ACR10N4L | 1129P-ACR10N4L MegaDC Hyperscale Server

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Supermicro SSG-1129P-ACR10N4L | 1129P-ACR10N4L MegaDC Xeon 2S 3TB 2x25Gb SFP28 10 x HS 2.5 Scale Out NAS Object Storage Hyperscale Server

Key Features

  • Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
  • 16 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
  • 1 PCI-E 3.0 x16 slot for AIOM
  • 10 Hot-swap 2.5″ SAS3/SATA3 drive bays (4 NVMe/SAS3/SATA3 hybrid ports)
  • Broadcom 3216 SAS3, IT mode
  • 2x 25Gb SFP28 onboard
  • 2 M.2 NVMe/SATA up to 80mm
  • 800W Redundant Power Supplies Platinum Level High-efficiency
  • Manufacturer’s part number: SSG-1029P-NES32R

Supermicro SSG-1129P-ACR10N4L Technical Specifications

Product SKUs
SSG-1129P-ACR10N4L
  • SuperStorage SSG-1129P-ACR10N4L (Black)
Motherboard
Super X11DPD-M25
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
    Dual UPI up to 10.4GT/s
  • Support CPU TDP up to 205W*
Cores
  • Up to 28 Cores
Note  BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R).
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
  • Supports Intel® Optane™ DCPMM††
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note  2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
†† Cascade Lake only. Contact your Supermicro sales rep for more info.
On-Board Devices
Chipset
  • Intel® C621 chipset
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Dual LAN with SoC
  • Mellanox CONNECTX-4 LX EN 25GbE
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
Input / Output
LAN
  • 2x 25G SFP28 LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 2 USB 2.0 ports (front via header)
  • 2 USB 3.0 ports (rear)
Video
  • 1 VGA port
Others
  • TPM 2.0 Header, 1 Micro USB (COM Port)
System BIOS
BIOS Type
  • AMI 32Mb SPI Flash ROM
Management
Software
Power Configurations
  • ACPI / APM Power Management
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U Rackmount
Model
  • CSE-LB16TS-R804AMP
Dimensions and Weight
Width
  • 17.2″ (437mm)
Height
  • 1.7″ (43mm)
Depth
  • 23.5″ (597mm)
Weight
  • Gross Weight: 34 lbs (15.6 kg)
  • Net Weight: 23.5 lbs (10.6 kg)
Available Colors
  • Black
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • Network activity LEDs
  • Universal Information (UID) LED
Expansion Slots
PCI-Express
    • 1 PCI-E 3.0 x16 slot for AIOM
    • 1 PCI-E 3.0 x16 Left riser slot
    • 1 PCI-E 3.0 x8 Right riser slot
    • 2 Proprietary PCI-E 3.0 x8 connectors
    • 1 PCI-E 3.0 x16 (AOM Broadcom 3216 SAS3 IT Mode)

(Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)

Drive Bays
Hot-swap
  • 10 Hot-swap 2.5″ SAS3/SATA3 HDD bays (4 NVMe/SAS3/SATA3 hybrid ports)
Backplane
NVMe/SAS/SATA Backplane
System Cooling
Fans
  • 6x 40x56mm counter-rotation PWM fans
Power Supplies
800W Redundant Power Supplies with PMBus
Total Output Power
  • 750W with Input 100 – 127Vac
  • 800W with Input 200 – 240Vac
  • 800W with Input 230 – 240Vdc
Dimension
(W x H x L)
  • 54.5 x 40.25 x 220 mm
Input
  • 100 – 127Vac / 50-60Hz
  • 200 – 240Vac / 50-60Hz
  • 230 – 240Vdc / 50-60Hz
+12V
  • Max: 62.5A & Min: 0.5A (100Vac-127Vac)
  • Max: 66.6A & Min: 0.5A (200Vac-240Vac)
  • Max: 66.6A & Min: 0.5A (230-240Vdc)
+5V sb
  • Max: 4A / Min: 0A
Output Type
  • Gold Finger Connector Mating with Molex 45984-4343
Certification Platinum Level Certified
Platinum Certified
Test Report ]
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature:
    10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature:
    -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity:
    8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
    5% to 95% (non-condensing)
Weight 65 lbs
Dimensions 30.04 × 17.26 × 1.7 in

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