- Manufacturer Part Number: SYS-6029BT-HNC0R
- Number of Nodes: 4
- Number of Processors Supported: 2
- Processor Socket: Socket P LGA-3647
- Processor Supported:
- Xeon Platinum
- Xeon Gold
- Xeon Silver
- Xeon Bronze
- 64-bit Processing: Yes
- Chipset Manufacturer: Intel
- Chipset Model: C621
- Maximum Memory: 6 TB
- Memory Technology: DDR4 SDRAM
- Memory Standard: DDR4-2933/PC4-23466
- Number of Total Memory Slots: 24
- Intel Optane Memory Ready: Yes
- Controller Type: 12Gb/s SAS
- Graphics Controller Manufacturer: ASPEED
- Graphics Controller Model: AST2500
- Ethernet Technology: Gigabit Ethernet
- Number of Total Expansion Bays: 3
- Number of 3.5″ Bays: 3
- Number of Total Expansion Slots: 3
- Number of PCI Express x16 Slots: 2
- Total Number of USB Ports: 2
- Number of USB 3.0 Ports: 2
- Input Voltage: 230 V AC
- Number of Power Supplies Installed: 2
- Maximum Power Supply Wattage: 2200 W
- Color: Black
- Form Factor: Rack-mountable
- Rack Height: 2U
- Height: 3.5″
- Width: 17.6″
- Depth: 30.1″
- Weight (Approximate): 56 lb
- Package Contents:
- SuperServer 6029BT-HNC0R (Black)
- 4 x Super X11DPT-B Motherboard
- 1 x 2U Chassis
- 4 x Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe
- 1 x 2U 12-Port 4-Node Hybrid Backplane Supports 3×3.5
- 2 x PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
- 12 x Black gen 8 hot-swap 3.5
- 1 x SC827B BigTwin type I (Impact) BPN retention bkt assy
- 4 x Bigtwin air box for X11DPT-B(4pcs/set)
- 4 x Bigtwin 2U4N plastic air shroud (2pcs) for Cascade lake MB
- 1 x 6029BT-HNC0R Quick Reference Guide
- 4 x RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
- 4 x 1U RHS TwinPro Riser card with one PCI-E x16 slot
- 4 x 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
- 4 x 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
- 2 x 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48
- Environmentally Friendly: Yes
- Environmental Certification: RoHS
- Limited Warranty: 3 Year
Package Contents
- SuperServer 6029BT-HNC0R (Black)
- 4 x Super X11DPT-B Motherboard
- 1 x 2U Chassis
- 4 x Big Twin 1U hybrid ADP supporting 6x SAS3 and 4x NVMe
- 1 x 2U 12-Port 4-Node Hybrid Backplane Supports 3×3.5
- 2 x PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
- 12 x Black gen 8 hot-swap 3.5
- 1 x SC827B BigTwin type I (Impact) BPN retention bkt assy
- 4 x Bigtwin air box for X11DPT-B(4pcs/set)
- 4 x Bigtwin 2U4N plastic air shroud (2pcs) for Cascade lake MB
- 1 x 6029BT-HNC0R Quick Reference Guide
- 4 x RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
- 4 x 1U RHS TwinPro Riser card with one PCI-E x16 slot
- 4 x 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
- 4 x 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism
- 2 x 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48
Overview
The Supermicro BigTwin™ is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro’s Twin architecture is fully optimized for today’s diverse workloads and architected for further technology breakthroughs.
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Performance: Supporting the 2nd generation Intel® Xeon® Scalable processors up to 205W, the BigTwin achieves incredible performance in a 2U multi-node platform. Each node of the BigTwin supports up to 6TB DDR4-2933MHz in 24 DIMM slots for dramatically faster and increased memory capacity compared to previous generations of Twin systems, as well as support for Intel® Optane™ DC Persistent Memory. With up to 12 hot-swappable 2.5″ drive bays per node, storage performance is accelerated with options for All-Flash NVMe, SAS or SATA drives.
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Density: BigTwin systems boast incredibly high density with up to 4 hot swappable nodes in a 2U form factor, and double the I/O capacity of competitive 2U solutions. Support for Supermicro I/O Module (SIOM) enables flexible networking options of 1G, 10G, 25G, or 100G Ethernet or 100G InfiniBand/Omni-Path and frees up 2 low-profile PCI-E 3.0 x16 expansion slots per node.
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Efficiency: Supermicro’s Twin architecture is designed with power and cost efficiency in mind. The BigTwin reduces power consumption with shared cooling and power design, leveraging redundant 2200W high efficiency (96%) power supplies. Maximum compute in a 2U system enables data center footprints to be reduced by 50% compared to standard 2U servers with equivalent performance.